Part Number Hot Search : 
LV5234V T89C51 C1815 IBU60 MJE130 93C66A CES5622 812D240
Product Description
Full Text Search
 

To Download MC10H332FN Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 MC10H332 Dual Bus Driver/Receiver with 4-to-1 Output Multiplexers
Description
The MC10H332 is a Dual Bus Driver/Receiver with four-to-one output multiplexers. These multiplexers have common selects and output enable. When disabled, (OE = high) the bus outputs go to -2.0 V. The parameters specified are with 25 W loading on the bus drivers and 50 W loads on the receivers.
Features
http://onsemi.com MARKING DIAGRAMS*
MC10H352P AWLYYWWG
* Propagation Delay, 1.5 ns Typical Data-to-Output * Improved Noise Margin 150 mV (Over Operating Voltage and * * *
Temperature Range) Voltage Compensated MECL 10KTM Compatible Pb-Free Packages are Available*
PDIP-20 P SUFFIX CASE 738
DIP & PLLC PIN ASSIGNMENT
VCC XBUS X0 X1 X2 X3 S0 S1 XIN VEE 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCC02 YBUS OE Y0 Y1 Y2 Y3 RE YIN VCC01 A WL YY WW G 20 1 PLLC-20 FN SUFFIX CASE 775
1 20
10H332G AWLYYWW
= Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
*For additional marking information, refer to Application Note AND8002/D.
Pin assignment is for Dual-in-Line Package..
NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained. Receiver outputs are terminated through a 50 W resistor to -2.0 Vdc. Bus outputs are terminated through a 25 W resistor to -2.0 Vdc.
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2006
February, 2006 - Rev. 7
1
Publication Order Number: MC10H332/D
MC10H332
Table 1. MAXIMUM RATINGS
Symbol VEE VI Iout TA Tstg Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current - Continuous - Surge Characteristic Rating -8.0 to 0 0 to VEE 50 100 0 to +75 -55 to +150 -55 to +165 Unit Vdc Vdc mA C C C
Operating Temperature Range Storage Temperature Range - Plastic - Ceramic
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS (VEE = -5.2 V 5%) (Note 1)
0 Symbol IE IinH Characteristic Power Supply Current Input Current High Pins 3,4,5,6,14, 15,16,17 Pins 7,8 Pins 13, 18 Input Current Low High Output Voltage Low Output Voltage High Input Voltage Low Input Voltage Min - Max 115 Min - 25 Max 110 Min - 75 Max 115 Unit mA mA - - - 0.5 -1.02 -1.95 -1.17 -1.95 667 437 456 - -0.84 -1.63 -0.84 -1.48 - - - 0.5 -0.98 -1.95 -1.13 -1.95 417 273 285 - -0.81 -1.63 -0.81 -1.48 - - - 0.3 -0.92 -1.95 -1.07 -1.95 417 273 285 - -0.735 -1.60 -0.735 -1.45 mA Vdc Vdc Vdc Vdc
IinL VOH VOL VIH VIL
1. Each MECL 10HTM series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained. Outputs are terminated through a 50 W resistor to -2.0 V.
Table 3. AC PARAMETERS
0 Symbol tpd Characteristic Propagation Delay Data-to-Bus Output Select-to-Bus Output OE-to-Bus Output Bus-to-Receiver Select-to-Receiver RE-to-Receiver Data-to-Receiver Rise Time Fall Time Min 0.8 0.8 0.8 0.8 1.8 0.8 1.3 0.5 0.5 Max 3.0 3.4 2.4 2.1 4.5 2.2 4.0 2.0 2.0 Min 0.8 0.8 0.8 0.8 1.8 0.8 1.3 0.5 0.5 25 Max 3.0 3.4 2.4 2.1 4.5 2.2 4.0 2.0 2.0 Min 0.8 0.8 0.8 0.8 1.8 0.8 1.3 0.5 0.5 75 Max 3.2 3.8 2.6 2.4 5.0 2.5 4.5 2.1 2.1 ns ns Unit ns
tr tf
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.
http://onsemi.com
2
MC10H332
Table 4. MULTIPLEXER TRUTH TABLE
OE H L L L L S1 X L L H H S0 X L H L H XBus -2.0V X0 X1 X2 X3 YBus -2.0V Y0 Y1 Y2 Y3
Table 5. RECEIVER TRUTH TABLE
RE H L Xin L XBus Yin L YBus
LOGIC DIAGRAM
OE X0 X1 X2 X3 S0 S1 Y0 Y1 Y2 Y3 XIN RE YIN 18 3 4 5 6 7 8 17 16 15 14 9 13 12 VCC VCC01 VCC02 VEE = = = = PIN 1 PIN 11 PIN 20 PIN 10 19 YBUS 2 XBUS
ORDERING INFORMATION
Device MC10H332FN MC10H332FNG MC10H332FNR2 MC10H332FNR2G MC10H332P MC10H332PG Package PLLC-20 PLLC-20 (Pb-Free) PLLC-20 PLLC-20 (Pb-Free) PDIP-20 PDIP-20 (Pb-Free) Shipping 46 Units / Rail 46 Units / Rail 500 / Tape & Reel 500 / Tape & Reel 18 Unit / Rail 18 Unit / Rail
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
http://onsemi.com
3
MC10H332
PACKAGE DIMENSIONS
20 LEAD PLLC CASE 775-02 ISSUE E
B -N- Y BRK D -L- -M- W D V 0.010 (0.250) T L-M N Z 0.007 (0.180) M T L-M U
S
N
S S
0.007 (0.180) M T L-M
N
S
20
1
X VIEW D-D
G1
S
S
S
A Z R
0.007 (0.180) M T L-M 0.007 (0.180) M T L-M
S
N N
S
S
S
H K1
0.007 (0.180) M T L-M
S
N
S
C
E G G1 0.010 (0.250) S T L-M 0.004 (0.100) J -T- VIEW S
S SEATING PLANE
K F VIEW S 0.007 (0.180) M T L-M
S
N
S
N
S
NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10 _ 0.310 0.330 0.040 ---
MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10 _ 7.88 8.38 1.02 ---
http://onsemi.com
4
MC10H332
PACKAGE DIMENSIONS
PDIP-20 P SUFFIX PLASTIC DIP PACKAGE CASE 738-03 ISSUE E
-A-
20 1 11 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. DIM A B C D E F G J K L M N INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01
B
10
C
L
-T-
SEATING PLANE
K E G F D
20 PL
N J 0.25 (0.010)
M 20 PL
M
0.25 (0.010) TA
M
M
TB
M
MECL 10H and MECL 10K are trademarks of Motorola, Inc.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
http://onsemi.com
5
MC10H332/D


▲Up To Search▲   

 
Price & Availability of MC10H332FN

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X